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mga-13316 high gain, high linearity low noise amplifier data sheet description avago technologies mga-13316 is a two stage, easy-to- use gaas mmic low noise amplifier (lna). the lna has low noise with good input return loss and high linearity achieved through the use of avago technologies propri- etary 0.25 m gaas enhancement-mode phemt process. minimum matching needed for input, output and the inter-stage between the two lna. it is designed for optimum use between 2.2 ghz to 4 ghz. for optimum performance at lower frequency from 400 mhz to 1.5 ghz, mga-13116 is recommended. for optimum performance at frequency from 1.5 ghz to 2.5 ghz, the mga-13216 is recommended. all these 3 products, mga-13116, mga-13216 and mga-13316 share the same package and pinout configuration. pin configuration and package marking 4.0 x 4.0 x 0.85 mm 3 16-lead qfn avago 13316 yyww xxxx top view bottom view note: package marking provides orientation and identification 13316 = product code yyww = year and work week of manufacture xxxx = lot number features low noise figure high gain high linearity performance excellent isolation gaas e-phemt technology [1] low cost small package size: 4.0 x 4.0 x 0.85 mm 3 excellent uniformity in product specifications meets msl1, lead-free and halogen free specifications 2.5 ghz; q1: 5 v, 53 ma (typ) q2: 5 v, 116 ma (typ) 0.76 db noise figure 34.3 db gain 50.3 db rfout q1 to rfin q2 isolation 41.8 dbm output ip3 23.5 dbm output power at 1db gain compression applications low noise amplifier for cellular infrastructure including gsm, cdma, td-lte, and w-cdma. other very low noise applications. simplified schematic attention: observe precautions for handling electrostatic sensitive devices. esd machine model = 90 v esd human body model = 600 v refer to avago application note a004r: electrostatic discharge, damage and control. notes: enhancement mode technology employs positive gate bias, thereby eliminating the need of negative gate voltage associated with conventional depletion mode devices. 1 2 3 4 10 11 12 9 16 15 14 13 5 6 7 8 q1 bias q1 q2 r4b c10 c8 r2 l3 r3 l1 c7 vdd1 c9b c1 c6 c3 l2 c5a c2 vdd2 c4 rfin rfout l4 r1 8 7 6 5 13 14 15 16 1 2 3 4 12 11 10 9 gnd all other pins nc C not connected pin 2 vbias pin 3 rfin q1 pin 10 rfout q2 pin 11 rfout q2 pin 13 rfin q2 pin 16 rfout q1
2 mga-13316 absolute maximum rating [1] t a = 25 c symbol parameter units absolute maximum vdd1 device voltage v 5.5 vdd2 device voltage v 5.5 idd1 q1 drain current ma 90 p d power dissipation [2] w 1.19 p in,max cw rf input power dbm 20 t j,max junction temperature c 150 t stg storage temperature c -65 to 150 thermal resistance thermal resistance [3] (v dd1 = 5.0 v, i dd1 = 53 ma, v dd2 = 5.0 v, i dd2 = 116 ma), jc = 39.59 c/w notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. this is limited by maximum vd and id. board temperature (t c ) is 25 c. for t c >103 c, derate the device power at 25 mw per c rise in board temperature adjacent to package bottom. 3. thermal resistance measured using infra- red microscopy technique. electrical specifications [1] rf performance at vdd1 = 5 v, vdd2 = 5 v, 2.5 ghz, t a = 25 c, measured on the demo board. symbol parameter and test condition units min. typ. max. idd1 current at q1 ma 40 53 68 idd2 current at q2 ma 96 116 138 nf noise figure db C 0.76 1.1 gain gain db 33 34.3 36.3 oip3 [2] output third order intercept point dbm 37 41.8 C op1db output power at 1 db gain compression dbm 22.1 23.5 C irl input return loss, 50 source db C -19.5 C orl output return loss, 50 load db C -10.5 C |s12| reverse isolation db C 50 C |isol 1-2 | isolation between output pin to input pin db C 50.3 C notes: 1. measurements obtained using demo board described in figure 7 with component list in table 1. input and output trace loss is not de-embedded from the measurement. 2. oip3 test condition: f tone1 = 2500 mhz, f tone2 = 2501 mhz with input power of -27 dbm per tone. 3. use proper bias, heatsink and derating to ensure maximum channel temperature is not exceeded. see absolute maximum ratings and application note for more details.
3 product consistency distribution charts [1,2] figure 1. idd1 @ 2.5 ghz, vdd1 = 5 v, lsl = 40 ma, nominal = 53 ma, usl = 68 ma figure 3. noise figure @ 2.5 ghz, vdd1 = 5 v, vdd2 = 5 v, nominal = 0.76 db, usl = 1.1 db figure 4. gain @ 2.5 ghz, vdd1 = 5 v, vdd2 = 5 v, lsl = 33 db, nominal = 34.3 db, usl = 36.3 db figure 5. oip3 @ 2.5 ghz, vdd1 = 5 v, vdd2 = 5 v, lsl = 37 dbm, nominal = 41.8 dbm figure 6. op1db @ 2.5 ghz, vdd1 = 5 v, vdd2 = 5 v, lsl = 22.1 dbm, nominal = 23.5 dbm figure 2. idd2 @ 2.5 ghz, vdd2 = 5 v, lsl = 96 ma, nominal = 116 ma, usl = 138 ma notes: 1. data sample size is 11 kpcs samples taken from 3 different wafers. future wafers allocated to this product may have nominal v alues anywhere between the upper and lower limits. 2. measurements are made on production test board which represents a trade-off between optimal gain, nf, oip3 and op1db. circuit losses have been de-embedded from actual measurements. lsl usl 40 50 60 70 lsl usl 90 100 110 120 130 140 usl 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 lsl 22 23 24 25 lsl 37 38 39 40 41 42 43 44 45 46 lsl usl 33 34 35 36
4 demo board layout demo board schematic figure 7. demo board layout diagram. figure 8. demo board schematic diagram. C recommended pcb material is 10 mils rogers r04350. C suggested component values may vary according to layout and pcb material. 1 2 3 4 10 11 12 9 16 15 14 13 5 6 7 8 q1 bias q1 q2 r4b c10 c8 r2 l3 r3 l1 c7 vdd1 c9b c1 c6 c3 l2 c5a c2 vdd2 c4 rfin rfout l4 r1 table 1. component list for 2.5 ghz matching part size value detail part number notes c1 402 1.8 pf (murata) grm1555c1h1r8cz01d dc blocking capacitor c2 402 100 pf (murata) grm1555c1h101jd01e dc blocking capacitor c3 402 2.7 pf (murata) mch155a2r7jk bypass capacitor c4 402 0.1 uf (murata) grm155r61a104ka01d bypass capacitor c5a 603 2.2 uf (murata) grm188r61a225ke34d bypass capacitor c5b n/a n/a n/a not used c6 402 1000 pf (murata) grm155r71h102ka01e dc blocking capacitor c7 402 10 pf (murata) grm1555c1h100jz01e bypass capacitors c8 402 10 pf (murata) grm1555c1h100jz01e bypass capacitors c9a n/a n/a n/a not used c9b 402 4.7 f (murata) grm155r60e475me760 bypass capacitors c10 402 4.7 f (murata) grm155r60e475me760 bypass capacitors c11 n/a n/a n/a not used c12 n/a n/a n/a not used c13 n/a n/a n/a not used l1 402 6.8 nh (coilcraft) 0402cs-6n8xjbw input match for nf l2 402 3.3 nh (toko) ll1005-fhl3n3s output match for q2 l3 402 6.8 nh (toko) ll1005-fhl6n8j output match for q1 l4 402 3.6 nh (coilcraft) 0402cs-3n6xjbw input match for q1 l5 n/a n/a n/a not used r1, r2 402 0 ohm (koa) rk73z1eltp bridging resistors r3 402 49.9 ohm (koa) rk73h1eltp49r9f stabilizing resistor for q1 r4a n/a n/a n/a not used r4b 402 3.6 kohm (rohm) mcr01j362 biasing resistor for q1 r5 n/a n/a n/a not used
5 mga-13316 typical performance in demoboard for 2.5 ghz t a = 25 c, v dd1 = 5.0 v, v dd2 = 5.0 v, i dd1 = 53 ma, i dd2 = 116 ma figure 9. nf vs frequency and temperature figure 10. gain vs frequency and temperature figure 11. oip3 vs frequency and temperature figure 12. op1db vs frequency and temperature figure 13. input return loss, output return loss, gain, & reverse isolation vs frequency figure 14. k-factor vs frequency and temperature -40 c 25 c 85 c -40 c 25 c 85 c rev isol irl orl gain -40 c 25 c 85 c -40 c 25 c 85 c 0.2 0.4 0.6 0.8 1 1.2 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 nf (db) frequency (ghz) 20 25 30 35 40 1.5 2 2.5 3 3.5 4 gain (db) frequency (ghz) 0 -40 c 25 c 85 c 0 0.5 1 1.5 2 2.5 3 3.5 4 5 4.5 0 2 4 6 8 101214161820 k-factor frequency (ghz) 21 21.5 22 22.5 23 23.5 24 24.5 25 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 op1db (dbm) frequency (ghz) 34 36 38 40 42 44 46 48 50 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 oip3 (dbm) frequency (ghz) -70 -60 -50 -40 -30 -20 -10 10 20 30 40 012345 irl,orl,gain,rev isol (db) frequency (ghz)
6 mga-13316 typical performance in demoboard for 2.5ghz t a = 25 c, v dd1 = 5.0 v, v dd2 = 5.0 v, i dd1 = 53 ma, i dd2 = 116 ma figure 15. irl vs frequency and temperature figure 16. orl vs frequency and temperature figure 17. idd1 vs vdd1 and temperature figure 18. idd2 vs vdd2 and temperature figure 19. oip3 vs output power and temperature at 2.5 ghz -25 -20 -15 -10 -5 2 2.5 3 3.5 4 irl (db) frequency (ghz) -25 -20 -15 -10 -5 2 2.5 3 3.5 4 orl (db) frequency (ghz) 0 10 20 30 40 50 60 70 0123456 idd1 (ma) vdd1 (v) 0 20 40 60 80 100 120 140 160 0123456 idd2 (ma) vdd2 (v) 20 25 30 35 40 45 50 0 5 10 15 20 25 oip3 (dbm) pout (dbm) -40 c 25 c 85 c -40 c 25 c 85 c -40 c 25 c 85 c -40 c 25 c 85 c -40 c 25 c 85 c
7 figure 20. notes: measurements are made on 10 mils rogers r04350 trl board. figure 20 shows the input and output reference plane for q1. 15 12 14 11 13 9 8 7 6 5 4 2 16 10 3 1 bias lna2 lna1 rf input reference plane rf output reference plane mga-13316 q1 typical scattering parameters, vdd1 = 5 v, idd1 = 50 ma freq ghz s11 s21 s12 s22 mag. ang. mag. ang. mag. ang. mag. ang. 0.1 0.9476 -12.2632 34.5057 160.7532 0.0047 11.7831 0.5890 -19.3593 0.5 0.7044 -47.1391 21.9467 122.3275 0.0042 57.5859 0.3650 -23.2918 0.9 0.5242 -68.5640 15.4283 98.9990 0.0082 67.2825 0.3377 -27.1103 1.0 0.4951 -72.7375 14.2599 94.3046 0.0090 71.7130 0.3295 -28.6361 1.5 0.3999 -90.7648 10.3743 74.9007 0.0135 73.4180 0.2990 -38.7699 1.7 0.3773 -97.0091 9.3573 68.1636 0.0156 74.2662 0.2845 -44.4387 1.9 0.3628 -102.5217 8.5296 61.7988 0.0171 73.3113 0.2709 -51.0121 2.0 0.3568 -105.3332 8.1756 58.6806 0.0185 74.7631 0.2648 -54.4426 2.5 0.3462 -117.1978 6.7358 43.8914 0.0241 73.9083 0.2413 -74.2707 3.0 0.3480 -125.6487 5.7740 29.9534 0.0300 72.3617 0.2386 -96.7672 4.0 0.3658 -137.1290 4.5433 3.0393 0.0458 66.7425 0.2715 -139.7999 5.0 0.4085 -153.2931 3.7927 -25.8685 0.0650 56.1926 0.3428 176.4105 6.0 0.4702 -176.1741 3.1671 -57.5236 0.0866 40.6304 0.4772 127.2305 7.0 0.5235 160.4259 2.4253 -89.2923 0.1022 22.5904 0.6697 93.7068 8.0 0.5567 142.9302 1.7724 -117.9984 0.1099 6.0176 0.7884 71.4942 9.0 0.5652 128.2157 1.3338 -143.5986 0.1175 -9.2834 0.8651 53.9815 10.0 0.5764 112.2267 1.0609 -169.8542 0.1303 -26.3840 0.9135 33.9307 11.0 0.6110 94.0142 0.8212 162.0386 0.1380 -46.0835 0.9153 9.5407 12.0 0.6359 74.4400 0.5789 137.9581 0.1302 -62.5887 0.9319 -4.7026 13.0 0.6909 61.5493 0.4055 119.0601 0.1192 -74.3752 1.0008 -6.4422 14.0 0.7561 55.5470 0.2934 102.1102 0.1122 -85.6306 0.9811 -8.8053 15.0 0.7687 49.0968 0.2247 82.2629 0.1099 -100.4473 0.9427 -20.3955 16.0 0.7709 25.7908 0.1633 55.9850 0.0967 -125.5991 0.9539 -37.7405 17.0 0.7710 -16.0165 0.0954 39.5175 0.0439 -147.7475 0.9593 -46.7449 18.0 0.1200 -24.7870 0.1282 27.9369 0.1451 -96.9288 0.9194 -57.6137 19.0 0.6142 21.6007 0.0644 10.0400 0.1137 -170.9741 0.9265 -68.6984 20.0 0.6121 -12.3158 0.0749 -32.7215 0.0722 -140.1984 0.8915 -78.5449 mga-13316 q1 typical noise parameters, vdd1= 5 v, idd1 = 50 ma freq ghz nfmin db gammaopt mag phiopt deg rn/50 1.50 0.46 0.29 43.20 0.06 1.70 0.45 0.30 63.30 0.06 1.90 0.58 0.27 66.60 0.06 2.00 0.54 0.26 84.50 0.06 2.20 0.53 0.21 88.20 0.05 2.50 0.60 0.17 112.90 0.05 2.70 0.67 0.17 160.50 0.04 2.90 0.68 0.17 157.80 0.05 3.30 0.68 0.24 -172.20 0.05 3.50 0.72 0.29 170.90 0.05 4.00 0.78 0.40 179.40 0.03
8 1 5 1 2 1 4 11 1 3 9 8 7 6 5 4 2 1 6 1 0 3 1 bias l na2 l na 1 r f o ut p ut refere n ce p l a n e r f i n p ut refere n ce p l a n e figure 21. notes: measurements are made on 10 mils rogers r04350 trl board. figure 21 shows the input and output reference plane for q2. mga-13316 q2 typical scattering parameters, vdd2 = 5 v, idd2 = 116 ma freq ghz s11 s21 s12 s22 mag. ang. mag. ang. mag. ang. mag. ang. 0.1 0.8724 172.0353 0.1413 -112.7154 0.0036 65.3831 0.8292 174.6930 0.5 0.8474 140.1052 1.5607 -80.8803 0.0085 97.0757 0.7645 149.3051 0.9 0.6825 97.0606 5.6920 -123.6645 0.0248 87.8937 0.5485 118.0392 1.0 0.5865 84.1827 7.0773 -139.4571 0.0314 80.4474 0.4499 109.9115 1.5 0.1423 121.2420 9.6368 140.8404 0.0481 30.1766 0.2033 151.0622 1.7 0.2352 127.2011 9.0963 118.4115 0.0478 15.1099 0.2422 152.5525 1.9 0.2848 115.3972 8.5861 99.9577 0.0472 3.1298 0.2483 147.5974 2.0 0.2958 108.3752 8.3840 91.7925 0.0461 -2.5589 0.2433 145.1175 2.5 0.2456 63.8963 7.8317 54.1684 0.0418 -32.2292 0.1619 141.3232 3.0 0.1638 -29.4140 7.7532 16.1359 0.0323 -73.1124 0.1204 -176.1177 4.0 0.6964 177.8403 6.1643 -73.8377 0.0279 140.3060 0.2679 173.3761 5.0 0.9402 119.6485 2.6318 -158.0828 0.0383 76.6959 0.2333 -125.8671 6.0 0.9483 86.9076 0.8464 145.2466 0.0472 52.2933 0.4868 -153.4601 7.0 0.9468 63.6793 0.3393 111.7191 0.0506 33.7091 0.4904 -173.3753 8.0 0.9714 46.0950 0.1877 77.8816 0.0547 20.9620 0.5367 176.2551 9.0 0.9301 27.7972 0.1149 41.1122 0.0547 4.2118 0.6319 162.5823 10.0 0.8606 17.9019 0.0705 16.9907 0.0470 -5.3221 0.7125 149.2561 11.0 0.9721 14.0126 0.0539 1.3504 0.0437 -13.1746 0.7438 137.7980 12.0 0.9895 1.8829 0.0390 -18.8103 0.0355 -30.2990 0.7126 120.6736 13.0 0.9504 -6.3036 0.0253 -32.1307 0.0244 -43.2860 0.7159 94.6400 14.0 0.9976 -15.2859 0.0102 -36.7154 0.0105 -59.8362 0.7653 74.7833 15.0 1.0065 -24.3699 0.0098 103.9489 0.0089 122.0001 0.7641 64.9085 16.0 0.9938 -32.7298 0.0351 103.0363 0.0351 107.6657 0.7375 50.6656 17.0 0.9802 -44.7104 0.0714 86.2511 0.0713 88.0832 0.7318 25.3774 18.0 0.9647 -57.3892 0.1406 55.3523 0.1406 55.7281 0.7347 -9.4297 19.0 0.9158 -61.5557 0.1291 -26.7187 0.1285 -26.7652 0.2011 -33.2109 20.0 0.9422 -62.6624 0.1319 50.0625 0.1307 49.6143 0.5420 4.8232 mga-13316 q2 typical noise parameters, vdd2 = 5 v, idd2 = 116 ma freq ghz nfmin db gammaopt mag phiopt deg rn/50 1.50 2.17 0.31 -87.10 0.30 1.70 2.11 0.21 -89.90 0.27 1.90 2.09 0.21 -95.10 0.25 2.00 2.00 0.19 -94.70 0.24 2.20 1.93 0.16 -105.80 0.23 2.50 2.06 0.14 -112.40 0.22 2.70 2.08 0.16 -129.40 0.21 2.90 2.08 0.15 -148.20 0.20 3.50 2.15 0.34 178.80 0.13 4.00 2.42 0.57 -163.60 0.09
9 package dimensions pcb land patterns and stencil design notes: 1. all dimensions are in milimeters. 2. 4 mil stencil thickness recommended. land pattern stencil opening combination of land pattern & stencil opening 4.00 0.65 2.70 3.96 2.16 4.00 2.70 4.00 3.96 2.70 2.16 3.96 2.16 0.40 0.30 0.65 0.36 0.27 0.65 0.40 0.30 0.36 0.27 2.70 2.16 pi n #1 id e nt i fi ca t io n c h a m fer 0.30 x 45 0.40 0. 1 0 4.00 0. 1 0 0.00 C 0. 1 0 0.203 ref. 1 .95 ref. 0.65 bsc 4.00 0. 1 0 pi n 1 do t b y m ar k i ng 2.70 0. 1 0 ex p.dap 2.70 0. 1 0 ex p.dap 0.85 0. 1 0 t op view s i d e view bo tt om view a v ago 1 33 1 6 yyww xxxx 0.30 0. 1 0
10 device orientation tape dimensions u s e r fee d d i r e c ti on t op view e nd view u s e r fee d d i r e c ti on co ve r t ap e carr ie r t ap e r eel a v ago 1 33 1 6 yyww xxxx a v ago 1 33 1 6 yyww xxxx a v ago 1 33 1 6 yyww xxxx 10 max 10 max 4.25 0.10 4.25 0.10 1.13 0.10 5.50 0.05 1.75 0.10 8.00 0.10 ? 1.50 0.10 12.0 0.30 C0.10 ? 1.50 0.25 2.00 0.05 4.00 0.10 a. k. b. 0.279 0.02 part number ordering information part number no. of devices container mga-13316-tr1g 1000 7 reel MGA-13316-BLKG 100 antistatic bag
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2011 avago technologies. all rights reserved. av02-3239en - december 23, 2011 reel dimensions (7 inch reel) ps 6 ps 6 back view ?178.00.5 ?55.00.5 6.25 mm embossed letters lettering thickness: 1.6 mm see detail "x" slot hole "b" slot hole(2x) 180 apart. slot hole "a": 3.00.5 mm (1x) slot hole "b": 2.50.5 mm (1x) ?13.0 65 45 r10.65 45 r5.2 embossed ribs raised: 0.25 mm , width: 1.25 mm 18.0* max. ?51.20.3 ?178.00.5 recycle logo front view 120 1.5 min. ?20.2 min. -0.2 +0.5 detail "x" -0.0 +1.5* 12.4 detail "y" (slot hole) 3.5 1.0 see detail "y" front back front back slot hole "a" ?178.00.5

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